Fraunhofer IZM specializes in industry-oriented applied research. Fraunhofer IZM develops assembly and interconnection technology, also known as electronic packaging. Almost invisible and undervalued by many, electronic packaging is at the heart of every electronic application. Our technologies connect the individual components, protect components and devices from vibration and moisture, and reliably dissipate heat. Fraunhofer IZM thus ensures that electronic devices continue to function reliably in even the harshest conditions.

Department of Microsystems has five research groups: BioMEMS, Safe Distributed Systems, Digital Design and Autonomy, Materials and Micro Integration, and Micro and Nano Mechanical Systems. Core competence in development of micro sensors, MEMS design, MEMS fabrication, microelectronics, front-end sensor readout circuits, packaging of microsystems, microsystem integration and characterization.

Fraunhofer Institute for Reliability and Microintegration IZM is a research institute within the Fraunhofer Society: it makes use of technology for miniaturised integration of microelectronic, microsensor, microfluidic and micro-optical systems to create innovative solutions for the medical industry.

Within NerveRepack Fraunhofer IZM is focused on the biocompatible packaging of the implantable system. The Technologies for Bioelectronics (TBE) Group focuses on different aspects related to the assembly, packaging, and long- term performance of conformally-coated active neural interfaces.

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