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Team of Industrial Engineers

Fraunhofer Institute for Reliability and

Microintegration IZM (FIZM), DE

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Fraunhofer Institute for Reliability and Microintegration IZM is a research institute within the Fraunhofer Society: it makes use of technology for miniaturised integration of microelectronic, microsensor, microfluidic and micro-optical systems to create innovative solutions for the medical industry. The Technologies for Bioelectronics (TBE) Group focuses on different aspects related to the assembly, packaging, and long- term performance of conformally-coated active neural interfaces. The TBE team has been investigating the fundamental mechanisms that determine the longevity of polymeric and thin-film layers for the conformal encapsulation of active implants and has been conducting year-long studies to investigate the degradation mechanisms of bare silicon CMOS chips in wet ionic environments such as the human body. Within NerveRepack Fraunhofer IZM is focused on the biocompatible packaging of the implantable system.

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Project Coordinator

 

Carmen Moldovan

IMT Bucharest

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126a Erou Iancu Nicolae Street

077190 Voluntari

Romania

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nerverepack.contact@imt.ro

Acknowledgement Logos

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© 2024 by NerveRepack. All rights reserved.

Acknowledgement

NerveRepack is co-funded by the European Union under Grant Agreement nº 101112347. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the CHIPS Joint Undertaking. Neither the European Union nor the granting authority can be held responsible for them.

The project is supported by the CHIPS Joint Undertaking and its members including top-up funding by Romania, Germany, Norway, Italy, The Netherlands, Greece, Portugal, Poland, Spain and Switzerland.

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