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Team of Industrial Engineers

Fraunhofer Institute for Reliability and

Microintegration IZM (FIZM), DE

Fraunhofer_IZM_Copyright_Frank_Welke (12).TIF

Fraunhofer Institute for Reliability and Microintegration IZM is a research institute within the Fraunhofer Society: it makes use of technology for miniaturised integration of microelectronic, microsensor, microfluidic and micro-optical systems to create innovative solutions for the medical industry. The Technologies for Bioelectronics (TBE) Group focuses on different aspects related to the assembly, packaging, and long- term performance of conformally-coated active neural interfaces. The TBE team has been investigating the fundamental mechanisms that determine the longevity of polymeric and thin-film layers for the conformal encapsulation of active implants and has been conducting year-long studies to investigate the degradation mechanisms of bare silicon CMOS chips in wet ionic environments such as the human body. Within NerveRepack Fraunhofer IZM is focused on the biocompatible packaging of the implantable system.

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