PROUD Sàrl, CH

To tackle the problem of heat management, we have invented an innovative method allowing epitaxial deposition of high-quality diamond directly on foreign substrates without any interlayer. Our diamond layer, with the highest heat dissipation capacity of any existing material, deposited on chips from manufacturers and foundries allows a direct upgrade in heat extraction, output power and efficiency. 

Thus, thanks to our patented technology,  we aim to unleash the full power of the new generation of chips developed for AI and quantum computing without disruption of the value chain of our customers.

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As part of the NerveRepack project and more specifically with the team involved in the electronics platform, PROUD will design and implement its technology to integrate its diamond heat sink within the power supply and electrical components used to control the exoprosthesis and the exoskeleton.