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Team of Industrial Engineers

Salvia BioElectronics (SAL), NL

Salvia BioElectronics is a medical device company pioneering neuromodulation therapies for migraine. Salvia's unique, paper-thin implant is designed to reduce the frequency and intensity of migraine attacks by delivering gentle electrical pulses to the nerves associated with the condition. The company is currently in the clinical stage of development. In addition, Salvia is considering potential opportunities the device creates for the treatment of cluster headache and other neurological disorders. Salvia has received the Breakthrough Device Designation from the United States Food and Drug Administration (FDA), which facilitates expedited market access for devices that treat life-threatening or irreversibly debilitating conditions.

Salvia has lab infrastructure in place for pilot manufacturing of implantable medical devices, as well as validated test protocols and infrastructure for performance verification of the conformal soft encapsulated electronics on both reference structures and implantable devices. In collaboration with IMEC, Salvia will contribute to the highly efficient wireless (inductive) powering of the shallow implant, as well as system definition and circuit integration into few components to ensure long-term reliability. Additionally, Salvia will work closely with FIZM, Acquandas and TUD on the implantable system integration using highly miniaturized and conformal PDMS encapsulation of the implant electronics.

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Project Coordinator

 

Carmen Moldovan

IMT Bucharest

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126a Erou Iancu Nicolae Street

077190 Voluntari

Romania

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nerverepack.contact@imt.ro

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© 2024 by NerveRepack. All rights reserved.

Acknowledgement

NerveRepack is co-funded by the European Union under Grant Agreement nº 101112347. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the CHIPS Joint Undertaking. Neither the European Union nor the granting authority can be held responsible for them.

The project is supported by the CHIPS Joint Undertaking and its members including top-up funding by Romania, Germany, Norway, Italy, The Netherlands, Greece, Portugal, Poland, Spain and Switzerland.

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